The atomic layer deposition technique is a kind of chemical vapor deposition method. Al, Ti, Zn, Hf are some of the resources used in ALD. These sources are filled into the reactor with carrier nitrogen gas. In this process, each weld forms a single layer on the surface. These processes are carried out sequentially and a reaction occurs on the surface. This cycle is repeated, the layers forming a thin film on the surface. In this way, the film thickness is controlled and defined. A homogeneous coating is achieved. It is possible to coat conformally even on shaped surfaces.

ALD is used in microelectronics and bioengineering fields.

NANOLIZED ALD systems are designed at very affordable costs. ALD Systems developed in collaboration with researchers and Nanolysis meet the requirements.

Thermal ALD systems are produced in 3 different models: NL-AL 100, NL-AL 200, NL-AL 300. Samples with a diameter of 100 mm can be coated with the NL-AL 100 model, 200 mm with the NL-AL 200 model and 300 mm with the NL-AL 300 model.

Heaters can provide temperatures up to 300 degrees and temperature control can also be done. The device is available fully automatic with 4 types of coating sources.

In addition to all these, the Ozone Generator can be integrated into the system, thus providing more specific coverage. RF Plasma source can also be added to the system.